Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811314 | Method of forming semiconductor device having a dual material redistribution line | Chun-Chang Liu | 2020-10-20 |
| 10541218 | Redistribution layer structure and fabrication method therefor | Chun-Chang Liu, Sheng-Wei Yeh | 2020-01-21 |