Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861823 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-08 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2020-11-24 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10658258 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2020-05-19 |