Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10849426 | Rear structure for display panel | Wen-Pin Wang, Yao-Shih Chung, I-Ting Huang, Yu-Jen Chang, Hai-Ping Xiang +6 more | 2020-12-01 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10770014 | Display device | Chia-Min Yeh, Hung-Hsun Chen, Cheng-Tso Chen, Li-Wei Sung | 2020-09-08 |
| 10655381 | Locking device and opening and closing mechanism having the same | Hui Liu, Kun Wang, Kai Chen, He Zhang, Quan Liu +1 more | 2020-05-19 |
| 10642118 | Display substrate and display device | Hung-Kun Chen, Yi-Chin Lee, Hong-Kang Chang, Yu-Chien Kao, Jui-Ching Chu +1 more | 2020-05-05 |
| 10640391 | LTO coated LRMO cathode and synthesis | Wenkui Zhang, Yang Xia, Liyuang Zhang, Yishun Wang, Chu Liang +3 more | 2020-05-05 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10620656 | Operating voltage switching device with current mirror | Chih-Cheng Lin, Kai Liu | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10546537 | Display device with display drivers arranged on edge thereof | Yi-Cheng Tsai, Cheng-Tso Chen, Li-Wei Sung | 2020-01-28 |