Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2020-09-29 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |