Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Cheng-Ting Chen | 2020-09-22 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2020-01-14 |