Issued Patents 2020
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879192 | Semiconductor structure and manufacturing method thereof | Hsaing-Pin Kuan, Chih-Wei Lin, Chun-Cheng Lin, Yu-Wei Lin, Chun-Yen Lan | 2020-12-29 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin | 2020-12-15 |
| 10867890 | Mutli-chip package with encapsulated conductor via | Chien Ling Hwang, Hsin-Hung Liao, Sung-Yueh Wu | 2020-12-15 |
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2020-12-15 |
| 10818614 | Package structure | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2020-10-06 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Shing-Chao Chen, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10773294 | Clamping mechanism | Hsin-Wei Chu, Pin-Jyun Chen, Hui-Chi Chang, Po-Fu Hsu, Chien-Fa Huang | 2020-09-15 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2020-08-11 |
| 10700010 | Copper contact plugs with barrier layers | Li-Lin Su, Huang-Ming Chen, Hsueh Wen Tsau | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2020-06-02 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2020-05-19 |
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2020-04-28 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2020-01-14 |