Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2020-12-15 |
| 10840111 | Chip package with fan-out structure | Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Ching-Hua Hsieh, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |