Issued Patents 2020
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Chung-Shi Liu | 2020-12-29 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Chen-Hua Yu, Meng-Tse Chen, Chung-Shi Liu | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo | 2020-12-08 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Wei-Yu Chen | 2020-11-17 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen +1 more | 2020-11-10 |
| 10811369 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2020-10-20 |
| 10797005 | Semiconductor package and method for manufacturing the same | Chen-Shien Chen, Ming-Chih Yew, Yu-Tse Su | 2020-10-06 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu +1 more | 2020-10-06 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2020-10-06 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Chung-Shi Liu, Chung-Cheng Lin, Yu-Peng Tsai, Cheng-Ting Chen | 2020-09-22 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2020-08-04 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2020-07-14 |
| 10707084 | Method of manufacturing wafer level chip scale package | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Chung-Shi Liu | 2020-07-07 |
| 10700033 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Wen-Hsiung Lu, Bor-Rung Su | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2020-06-02 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Chung-Shi Liu | 2020-05-26 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2020-05-19 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2020-04-21 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang +1 more | 2020-03-24 |
| 10586724 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kou | 2020-03-10 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |