Issued Patents 2020
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879228 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2020-12-29 |
| 10868106 | Semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku | 2020-12-15 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10867810 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2020-12-08 |
| 10854577 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Shou-Cheng Hu | 2020-12-01 |
| 10847493 | Bump-on-trace interconnect | Chen-Hua Yu | 2020-11-24 |
| 10833033 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2020-11-10 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2020-10-20 |
| 10797005 | Semiconductor package and method for manufacturing the same | Ming-Da Cheng, Ming-Chih Yew, Yu-Tse Su | 2020-10-06 |
| 10784223 | Elongated bump structures in package structure | Yao-Chun Chuang, Chita Chuang, Ming Hung Tseng | 2020-09-22 |
| 10756162 | Structure and formation method of semiconductor device with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2020-08-25 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2020-08-18 |
| 10748810 | Method of manufacturing an integrated inductor with protections caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang +1 more | 2020-08-18 |
| 10741477 | Semiconductor devices and methods of forming the same | Cheng-Lung Yang, Chih-Hung Su, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin | 2020-08-11 |
| 10734347 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2020-08-04 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10720487 | Structure and formation method of semiconductor device with magnetic element | Chin-Yu Ku, Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu | 2020-07-21 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2020-06-30 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo | 2020-06-23 |
| 10692828 | Package structure with protrusion structure | Pei-Haw Tsao, Li-Huan Chu | 2020-06-23 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2020-05-12 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Mirng-Ji Lii | 2020-05-05 |
| 10629580 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2020-04-21 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2020-02-25 |