Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen +7 more | 2020-10-20 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2020-08-11 |