Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2020-10-20 |