Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Cheng-Lin Huang, Wen-Ming Chen, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10720360 | Semiconductor die singulation and structures formed thereby | Cheng-Lin Huang, Wen-Ming Chen | 2020-07-21 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Cheng-Lin Huang, Chun-Yen Lo, Wen-Ming Chen, Kuo-Chio Liu | 2020-01-14 |