Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Shih-Yen Chen, Pin-Yi Hsin | 2020-12-08 |
RT
Ruei-Yi Tsai
Overall (2020): #291,839 of 565,922Top 55%
1
Patents 2020