Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Cheng-Lin Huang, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2020-08-11 |
| 10720360 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Cheng-Lin Huang | 2020-07-21 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Chun-Yen Lo, Kuo-Chio Liu | 2020-01-14 |