Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Wen-Ming Chen, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10770427 | Chip package structure and method for forming the same | Ling Li, Jung-Hua Chang | 2020-09-08 |
| 10748882 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2020-08-18 |
| 10741511 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2020-08-11 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2020-08-11 |
| 10720360 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2020-07-21 |
| 10699981 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2020-06-30 |
| 10658195 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2020-05-19 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Chun-Yen Lo, Wen-Ming Chen, Kuo-Chio Liu | 2020-01-14 |