Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833039 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2020-11-10 |
| 10770437 | Semiconductor package and manufacturing method of the same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2020-09-08 |
| 10756064 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-08-25 |
| 10748882 | Structure and formation method for chip package | Cheng-Lin Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2020-08-18 |
| 10720403 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jing-Cheng Lin | 2020-07-21 |
| 10672723 | Semiconductor package | Jing-Cheng Lin, Chin-Chuan Chang | 2020-06-02 |
| 10636747 | Semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2020-04-28 |
| 10629541 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-04-21 |
| 10622336 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-04-14 |
| 10529673 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jing-Cheng Lin | 2020-01-07 |