Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2020-04-28 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |