Issued Patents 2020
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867925 | Method for forming chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu, Po-Yao Lin | 2020-12-15 |
| 10867924 | Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2020-12-15 |
| 10804244 | Semiconductor package structure and method of manufacturing the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-10-13 |
| 10784220 | Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-09-22 |
| 10770437 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng | 2020-09-08 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2020-09-01 |
| 10741404 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-08-11 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2020-08-11 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10700032 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2020-06-30 |
| 10665473 | Package structure and method of fabricating the same | Chia-Hsiang Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Arunima Banerjee | 2020-05-26 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng, De-Dui Liao | 2020-04-28 |
| 10546830 | Chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-01-28 |
| 10535632 | Semiconductor package structure and method of manufacturing the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-01-14 |
| 10535597 | Semiconductor structure and manufacturing method thereof | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-01-14 |