Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867930 | Integrated fan-out packaging | Han-Ping Pu | 2020-12-15 |
| 10797007 | Semiconductor structure and manufacturing method thereof | Hsiu-Mei Yu | 2020-10-06 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2020-09-01 |
| 10750070 | Light-emitting diode and surveillance camera device using the same | I-Hsin Tung | 2020-08-18 |
| 10529671 | Package structure and method for forming the same | Hsien-Wen Liu, Shin-Puu Jeng | 2020-01-07 |