Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2020-09-01 |
HH
Han-Hsiang Huang
Overall (2020): #456,763 of 565,922Top 85%
1
Patents 2020