Issued Patents 2020
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879162 | Integrated fan-out packages | Dai-Jang Chen, Hsiang-Tai Lu, Hsien-Wen Liu, Chih-Hsien Lin, Shih-Ting Hung +1 more | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2020-12-22 |
| 10867925 | Method for forming chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu, Po-Yao Lin | 2020-12-15 |
| 10867924 | Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing | Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2020-12-15 |
| 10861801 | Wafer level package (WLP) and method for forming the same | Hsien-Wen Liu | 2020-12-08 |
| 10861835 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin | 2020-12-08 |
| 10854567 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou +1 more | 2020-12-01 |
| 10854579 | Semiconductor package structure | Feng-Cheng Hsu | 2020-12-01 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2020-12-01 |
| 10847414 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2020-11-24 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10804244 | Semiconductor package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2020-10-13 |
| 10804254 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Meng-Wei Chou, Meng-Liang Lin | 2020-10-13 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2020-10-06 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2020-09-29 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Kuang-Chun Lee, Yu-Sheng Lin, Po-Yao Lin | 2020-09-29 |
| 10784220 | Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer | Shuo-Mao Chen, Feng-Cheng Hsu | 2020-09-22 |
| 10770437 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen | 2020-09-08 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2020-09-01 |
| 10756064 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Jui-Pin Hung | 2020-08-25 |
| 10748882 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Hsien-Wen Liu | 2020-08-18 |
| 10741404 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2020-08-11 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2020-08-11 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2020-08-04 |
| 10727294 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Ebin Liao | 2020-07-28 |