Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790164 | Method for forming package structure | Wen-Yi Lin, Kuang-Chun Lee, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2020-09-29 |
CY
Che-Chia Yang
Overall (2020): #509,975 of 565,922Top 95%
1
Patents 2020