Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867925 | Method for forming chip package structure | Shin-Puu Jeng, Shuo-Mao Chen, Feng-Cheng Hsu | 2020-12-15 |
| 10867924 | Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu | 2020-12-15 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2020-12-01 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Kuang-Chun Lee, Yu-Sheng Lin, Shin-Puu Jeng | 2020-09-29 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10714463 | Method of forming semicondcutor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10685920 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2020-06-16 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2020-05-26 |