Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879162 | Integrated fan-out packages | Shin-Puu Jeng, Dai-Jang Chen, Hsiang-Tai Lu, Hsien-Wen Liu, Chih-Hsien Lin +1 more | 2020-12-29 |
| 10867924 | Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Feng-Cheng Hsu, Po-Yao Lin | 2020-12-15 |
| 10804254 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2020-10-13 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Shin-Puu Jeng | 2020-09-29 |