Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804254 | Fan-out package with cavity substrate | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2020-10-13 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2020-09-29 |