Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10804254 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2020-10-13 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2020-09-29 |