Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879166 | Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof | Hung-Jui Kuo, Ming-Tan Lee | 2020-12-29 |
| 10867793 | Semiconductor package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho, Ming-Tan Lee, Tzung-Hui Lee | 2020-12-15 |
| 10867811 | Semiconductor device | Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10692838 | Semiconductor packages | Chen-Cheng Kuo, Hung-Jui Kuo | 2020-06-23 |
| 10685896 | Integrated circuit package and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-06-16 |