Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879166 | Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2020-12-29 |
| 10867793 | Semiconductor package and method of fabricating the same | Zi-Jheng Liu, Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2020-12-15 |
| 10859922 | Lithography system and method | Chen-Hua Yu, Hung-Jui Kuo | 2020-12-08 |
| 10861710 | Methods of manufacturing semiconductor devices | Hung-Jui Kuo, Chen-Cheng Kuo, De-Yuan Lu | 2020-12-08 |