Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2020-12-01 |
| 10833053 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2020-11-10 |
| 10797023 | Integrated fan-out package and method of fabricating an integrated fan-out package | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-10-06 |
| 10665545 | Semiconductor devices, semiconductor packages and methods of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Meng-Che Tu | 2020-05-26 |
| 10658287 | Semiconductor device having a tapered protruding pillar portion | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-05-19 |
| 10658208 | Polyimide composition for package structure, package structure and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-05-19 |
| 10658199 | Semiconductor device and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-05-19 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-03-31 |