Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879147 | Method of manufacturing package structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-12-29 |
| 10872864 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-12-22 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2020-12-01 |
| 10804946 | Low power wake-up receiver | Haowei Jiang, Drew Hall, Patrick Mercier | 2020-10-13 |
| 10790212 | Method of manufacturing package structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-09-29 |
| 10763206 | Method of fabricating integrated fan-out packages | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-09-01 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-07-14 |
| 10529593 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-01-07 |
| 10529675 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-01-07 |