Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2020-10-06 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |