Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
CW
Chin-Hua Wang
Overall (2020): #510,862 of 565,922Top 95%
1
Patents 2020