Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2020-09-29 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2020-07-14 |