Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2020-12-01 |
| 10797005 | Semiconductor package and method for manufacturing the same | Chen-Shien Chen, Ming-Da Cheng, Yu-Tse Su | 2020-10-06 |
| 10685920 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2020-06-16 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2020-05-26 |