Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10698026 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2020-06-30 |
| 10685920 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2020-06-16 |