Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10782318 | Test probing structure | Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu +2 more | 2020-09-22 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2020-08-11 |
| 10725090 | Test circuit and method | Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2020-07-28 |
| 10718790 | Devices for high-density probing techniques and method of implementing the same | Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2020-07-21 |
| 10698026 | Testing holders for chip unit and die package | Kuo-Chuan Liu, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2020-06-30 |
| 10652987 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Ching-Nen Peng, Hung-Chih Lin, Hao-Chiang Cheng | 2020-05-12 |
| 10641819 | Alignment testing for tiered semiconductor structure | Ching-Nen Peng, Hung-Chih Lin, Hao Chen, Mincent Lee | 2020-05-05 |
| 10634717 | Testing apparatus and testing method | Tang-Jung Chiu, Hung-Chih Lin | 2020-04-28 |