Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790707 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2020-09-29 |
| 10725090 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2020-07-28 |
| 10718790 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2020-07-21 |
| 10698026 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2020-06-30 |
| 10652987 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Hung-Chih Lin, Hao-Chiang Cheng | 2020-05-12 |
| 10641819 | Alignment testing for tiered semiconductor structure | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Mincent Lee | 2020-05-05 |