Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10838001 | Bump ball testing system and method | Chewn-Pu Jou | 2020-11-17 |
| 10790707 | Composite integrated circuits and methods for wireless interactions therewith | Ching-Nen Peng, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2020-09-29 |