Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan | 2020-12-15 |
| 10840197 | Package structure and manufacturing method thereof | Hsin-Yu Pan | 2020-11-17 |
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Hsin-Yu Pan, Yi-Che Chiang | 2020-10-27 |
| 10818651 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2020-10-27 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10725090 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2020-07-28 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Yu-Feng Chen +1 more | 2020-07-21 |
| 10718790 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2020-07-21 |