Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Hao-Yi Tsai +2 more | 2020-12-29 |
| 10853616 | Fingerprint sensor device and method | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-01 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu +1 more | 2020-07-21 |
| 10707094 | Semiconductor package and manufacturing process thereof | Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10672489 | Electronic device with a fuse array mechanism | John E. Riley, Girish N. Cherussery, Scott E. Smith | 2020-06-02 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Jen Cheng, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai | 2020-05-19 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Chen-Shien Chen, Mirng-Ji Lii | 2020-05-05 |
| 10622031 | Power noise reduction technique for high density memory with gating | Harish N. Venkata | 2020-04-14 |
| 10553561 | Mechanisms of forming connectors for package on package | Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu | 2020-02-04 |