Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2020-12-08 |
| 10825798 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Chen-Hua Yu | 2020-11-03 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chen-Hua Yu | 2020-07-14 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10700001 | Forming bonding structures by using template layer as templates | Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2020-06-30 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Chen-Shien Chen | 2020-05-05 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |