Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-12-15 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-12-15 |
| 10854552 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-12-01 |
| 10825798 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-11-03 |
| 10804242 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Tsung-Ding Wang | 2020-10-13 |
| 10790210 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Yu-Min Liang | 2020-09-29 |
| 10785865 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-09-22 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-09-08 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-07-14 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2020-05-26 |
| 10651055 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2020-05-12 |
| 10638616 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-02-04 |
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-01-07 |