Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10777431 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsiun Lee | 2020-09-15 |
| 10728419 | System and method using matrix barcode information to perform point-to-point information exchange | Chun-Cheih Liao, Chun-Ping Huang | 2020-07-28 |
| 10665565 | Package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |
| 10651055 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsun Lee | 2020-05-12 |