Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879170 | Semiconductor package and manufacturing method thereof | Yung-Ping Chiang, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang +2 more | 2020-12-29 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |