Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868353 | Electronic device and manufacturing method thereof | Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10867952 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2020-12-15 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2020-11-03 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2020-09-08 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10692832 | Manufacturing method of semiconductor structure | Kai-Chiang Wu | 2020-06-23 |
| 10665537 | Package structure and manufacturing method thereof | Chien Ling Hwang, Kai-Chiang Wu | 2020-05-26 |
| 10553533 | Integrated fan-out package and manufacturing method thereof | Han-Ping Pu, Kai-Chiang Wu, Nan-Chin Chuang | 2020-02-04 |
| 10529666 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2020-01-07 |