Issued Patents 2020
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879197 | Package structure and method of fabricating package structure | Albert Wan, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu | 2020-12-29 |
| 10867890 | Mutli-chip package with encapsulated conductor via | Ching-Hua Hsieh, Hsin-Hung Liao, Sung-Yueh Wu | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2020-12-15 |
| 10867832 | Apparatus for holding semiconductor wafers | Chen-Hua Yu | 2020-12-15 |
| 10804234 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Yeong-Jyh Lin, Bor-Ping Jang, Hsiao-Chung Liang | 2020-10-13 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin | 2020-09-08 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2020-08-25 |
| 10734345 | Packaging through pre-formed metal pins | Chen-Hua Yu, Yeong-Jyh Lin | 2020-08-04 |
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2020-08-04 |
| 10727074 | Method and system for thinning wafer thereof | Bor-Ping Jang, Hsin-Hung Liao, Chung-Shi Liu | 2020-07-28 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2020-06-30 |
| 10679866 | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | Bor-Ping Jang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2020-06-09 |
| 10665537 | Package structure and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu | 2020-05-26 |