Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804234 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2020-10-13 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2020-09-08 |
| 10734345 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2020-08-04 |
| 10636661 | Apparatus and method for wafer bonding | Yeur-Luen Tu, Chin-Wei Liang | 2020-04-28 |
| 10636688 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeur-Luen Tu | 2020-04-28 |
| 10622342 | Stacked LED structure and associated manufacturing method | Ping-Yin Liu, Chi-Ming Chen | 2020-04-14 |