Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867890 | Mutli-chip package with encapsulated conductor via | Chien Ling Hwang, Ching-Hua Hsieh, Sung-Yueh Wu | 2020-12-15 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2020-09-08 |
| 10727074 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu | 2020-07-28 |
| 10679866 | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2020-06-09 |