Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867890 | Mutli-chip package with encapsulated conductor via | Chien Ling Hwang, Ching-Hua Hsieh, Hsin-Hung Liao | 2020-12-15 |
| 10837754 | Wireless passive strain sensor having outer and inner coil holders | Wen-Syang Hsu, Cheng Tu, Chia-Min Chao | 2020-11-17 |