Issued Patents 2020
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868156 | Method of forming epitaxial silicon layer and semiconductor device thereof | Yu-Hung Cheng, Po-Jung Chiang, Yen-Hsiu Chen | 2020-12-15 |
| 10868058 | Photodiode gate dielectric protection layer | Cheng-Hsien Chou, Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu | 2020-12-15 |
| 10868050 | Backside illuminated image sensor with negatively charged layer | Shyh-Fann Ting, Chih-Yu Lai, Cheng-Ta Wu, Ching-Chun Wang | 2020-12-15 |
| 10867834 | Semiconductor structure and manufacturing method thereof | Min-Ying Tsai | 2020-12-15 |
| 10847560 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2020-11-24 |
| 10840287 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2020-11-17 |
| 10790189 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more | 2020-09-29 |
| 10756222 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu | 2020-08-25 |
| 10748948 | Image sensor device and method | Yen-Chang Chu, Cheng-Yuan Tsai | 2020-08-18 |
| 10727097 | Mechanisms for cleaning substrate surface for hybrid bonding | Sheng-Chau Chen, Chih-Hui Huang, Cheng-Ta Wu, Chia-Shiung Tsai, Xiao-Meng Chen | 2020-07-28 |
| 10714600 | Bipolar junction transistor (BJT) base conductor pullback | Lih-Tien Shyu | 2020-07-14 |
| 10665456 | Semiconductor structure | Shih Pei Chou, Chen-Fa Lu, Jiech-Fun Lu, Chia-Shiung Tsai | 2020-05-26 |
| 10658474 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou +1 more | 2020-05-19 |
| 10658410 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Min-Ying Tsai | 2020-05-19 |
| 10636661 | Apparatus and method for wafer bonding | Yeong-Jyh Lin, Chin-Wei Liang | 2020-04-28 |
| 10636688 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeong-Jyh Lin | 2020-04-28 |
| 10569520 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng +1 more | 2020-02-25 |
| 10553474 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2020-02-04 |